EMI is becoming a serious issue as the data rate per lane and the number of parallel lines continue to grow rapidly. It is therefore essential for system-on-package (SOP) integrating multiple drivers to have smaller electromagnetic radiation and to minimize EMI inside active devices. Regulatory limits prescribed by FCC and CISPR are in place to control maximum radiation. The distorted differential signal in a communication link generates an unwanted common-mode CM component more severely at the backplane connector at double the Nyquist frequency and harmonics. The generated spectrum components are later radiated by PCB parasitic antennas and causes EMC failure. Therefore, it is essential to counter the EMI issue during the product design phase instead of handling it at the end of product development. The proposed architecture calibrates the pull-up and pull-down path resistance, conserving the RC constant over the PVT variations and results in 20% increase in symmetry of rising and falling edge and reduce the peak CM noise by 80% whilst achieving better signal quality.